Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB.Flat no-lead packages include an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad.The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA).
This report elaborates the market size, market characteristics, and market growth of the Quad-Flat-No-Lead Packaging(QFN) industry, and breaks down according to the type, application, and consumption area of Quad-Flat-No-Lead Packaging(QFN). The report also conducted a PESTEL analysis of the industry to study the main influencing factors and entry barriers of the industry.

In Chapter 3.4 of the report, the impact of the COVID-19 outbreak on the industry was fully assessed. Fully risk assessment and industry recommendations were made for Quad-Flat-No-Lead Packaging(QFN) in a special period. This chapter also compares the markets of Pre COVID-19 and Post COVID-19.
In addition, chapters 8-12 consider the impact of COVID-19 on the regional economy.

Key players in the global Quad-Flat-No-Lead Packaging(QFN) market covered in Chapter 13:
Microchip Technology Inc
Linear Technology Corporation
Amkor Technology
UTAC Group
STATS ChipPAC Pte. Ltd
Texas Instruments
ASE Industrial Holding, Co., Ltd.
NXP Semiconductor
Fujitsu Ltd

In Chapter 6, on the basis of types, the Quad-Flat-No-Lead Packaging(QFN) market from 2015 to 2025 is primarily split into:
Air-Cavity QFNs
Plastic Molded QFNs

In Chapter 7, on the basis of applications, the Quad-Flat-No-Lead Packaging(QFN) market from 2015 to 2025 covers:
Portable Devices
Radio Frequency (RF)
Wearable Devices
Others

Geographically, the detailed analysis of production, trade of the following countries is covered in Chapter 4.2, 5:
United States
Europe
China
Japan
India

Geographically, the detailed analysis of consumption, revenue, market share and growth rate of the following regions are covered in Chapter 8, 9, 10, 11, 12:
North America (Covered in Chapter 8)
United States
Canada
Mexico
Europe (Covered in Chapter 9)
Germany
UK
France
Italy
Spain
Others
Asia-Pacific (Covered in Chapter 10)
China
Japan
India
South Korea
Southeast Asia
Others
Middle East and Africa (Covered in Chapter 11)
Saudi Arabia
UAE
South Africa
Others
South America (Covered in Chapter 12)
Brazil
Others

Years considered for this report:
Historical Years: 2015-2019
Base Year: 2019
Estimated Year: 2020
Forecast Period: 2020-2025